Thermistor Bare Chips are very sensitive components of the total Thermistor system. If the quality of the Bare Chip is not fulfilling highest demands in quality, the whole system will suffer from it and only become an averaged one in quality and reliability.
The Bare Chip implemented in the Thermistor system, is the main source of quality and reliability for the final result. So the quality process, to produce a Bare Chip, begins with the sourcing of the pure basic materials and is ongoing through the whole manufacturing procedure. In every step the pureness and concentration of ingredients in the material is controlled and guaranteed, to achieve a product, fulfilling high quality requirements.

Further the connector assembly, soldering and coating of the Thermistor are important processes, which may have important influence onto the Thermistor systems quality and reliability.

But there is no need to spend most attention on the manufacturing process, if the key point , the Bare Chip, is not hermetically sealed against environmental and mechanical influences, due to it’s special characteristics and requirements to safeguard it’s pureness and quality.

Taking this into consideration, Joinset developed a Gold – Plating, over a Silver Electrode (patent pending), for the Thermistor Bare Chips.
This Gold – Plating is protecting the pureness of the Bare Chip against environmental influences, by isolating the silver electrode in the Bare Chips against oxidation and humidity. So the Bare Chip, before it’s final assembly and also assembled into the Thermistor system is of guaranteed pureness and quality. No Oxidation or deterioration, taking place in the storage time, between delivery and final assembly, will decrease the Bare Chip quality to a lower level and help to achieve sufficient Yield- Level rates.
Achieving a better Yield-Level also means to reduce cost and wasted time for the whole process.
Productivity and work efficiency will also increase and help to keep pricey competitiveness, in times of rising cost, against competitors, who use unsealed Bare Chips for Thermistor production.

Further advantages of the Gold-Plated Bare Chip are to be seen in functionality. The Gold surface provides optimal electrical parameters and if the coating of the Thermistor unit is leaking or broken, the Gold – Sealing will protect the implemented Bare Chip against environmental influences and keep the Thermistor systems functionality ongoing.
This provides highest reliability of the Thermistor system and makes it usable for the hardest application situations. High temperature and aggressive chemical environments will no longer influence the Bare Chip. As long as the assembled system is on function, the Gold-Plated Bare Chip will work without loosing reliability or increasing it’s tolerances.

Joinset’s Gold – Plated– Thermistor – Bare – Chip is a nearly perfect tool, to meet the highest quality requirements of the biomedical, automotive, wire less communications and building automation industries.
Where ever highest reliability, duration and ongoing functionality even in worst case situations is requested, the Gold – Plated – Bare – Chip from Joinset will meet the demands without any compromise.

New Developed Multifunctional Conductive Hotmelt Film


Following the markets and manufacturers needs of minimizing housings and PCB’s by also integrating more electrical and electronic components in downsized space, materials are needed, which combine functions to prevent from multiple and complicated manufacturing steps, which cause the risk of damaging the fragile component or system.

On the other hand, under the pressure of decreasing cost in developments of new systems and components, there is no room left for expensive and multiple devices and tools. Complete solutions, decreasing the amount of parts and tools to be handled, with a good cost – need relation are searched for.

The above mentioned arguments taking into consideration, Joinset developed a combined tool for bonding, water and oil proof sealing, ESD prevention and EMC shielding, based on an electrical conductive hotmelt film, applied onto an electrical conductive woven mesh fabric.

The implemented woven mesh fabric gives an excellent mechanical stability and electrical conductivity to the film. Therefore the ECHF can be used for cable harness for sealing and shielding applications in the automotive and building automation industry as well as in the electronics and medical industry.

Used as a contact strip, which is possible caused by the stability, given to the ECHF by the fabric, it prevents the contacted items from ESD overcharge. It may be used in high velocity paper copying systems, fax and printer units.

The high quality Thermoplastic and fabric materials used in the production of the ECHF, guarantee for a long work life time circle and an over average reliability of the ECHF. The film has a thickness of only 100 μm. 80 μm is the thickness of the PET - fabric, which is covered by 10 μm of Thermoplastic material on both sides.

The ECHF is easy to handle and needs no new tools, or special trained personnel, to be applied. So cost saving by its multifunctional characteristics and advantages in front of standard hotmelt films, cable bonders, or ESD strips, is easy to be seen. Also the multifunctional of the ECHF allows to decrease the amount of used items and makes production processes easier to oversee and to plan.


More detailed information about the pending patent and the ECHF are available at Joinset Co., Ltd. directly.

Contact the Overseas Unit by phone +82 31 495 2601