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Got patent for "Multi-purpose Conductive Tapes"

 Got patent for “Multi-purpose Conductive Tapes…

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Got patent for “Multi-purpose Conductive Tapes ”

Joinset got a patent for the basic theory and construction of “Multi-purpose Conductive Tapes” which was developed by Joinset.
This unique tape consists of lots of small conductive elastic rubber pillar as EMI gasket on conductive film with conductive adhesive layer.
The Pillar has good conductivity and resiliency.
The Film has good conductivity and flexibility like Cu, Al and Conductive Fabric Film.
The Adhesive has good conductivity and adhesion strength.
This tape can be cut or die cut any shape and size by die-cutting machine or knife as thin and small size EMI gasket and Tapes.
This product will be suitable for thin EMI gasket, Electric contact and EMI tapes having easy attachment method at low cost for Mobile devices.

● Thickness : 0.3mm ­― 1.5mm

 
Got US patent for “Solderable elastic & electric C

Got US patent for “Solderable elastic & electric…

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Got US patent for “Solderable elastic & electric Contacts”

Joinset got US patent for the basic theory and construction of “Solderable elastic & electric Contact” which was developed by Joinset.
This unique product is consists of elastic rubber as a core and elastic rubber coating as a adhesive layer and heat resistance polymer Film as a electric conductive layer.
The elastic rubber and the elastic rubber coating provide good resilient and mechanical properties.
The conductive Film like FCCL (Flexible Copper Clad Laminating in FPCB) provides good electric conductivity and flexibility.
This unique invention must be useful to make many kinds of new electrical connector, contact and EMI Gasket which could be soldered including reflow soldering by SMT (Surface Mount Technology)
The products using this invention will replace some of previous Metal contact such as “C” clip and Conductive Fabric EMI gasket due to productivity, quality and price.
For example, Joinset’s some products ( Joinset’s brand name “PCB gasket” & “Air contact”) using this invention al

 
Got US patent for new basic invention of SMD Ceram

Got US patent for new basic invention of SMD Ceramic…

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Got US patent for new basic invention of SMD Ceramic Chips and method for making the same :

Joinset got US patent for new ceramic technology and theory called Joinchip which was developed by Joinset.
Joinchip consists of electrically functional ceramic layer on a ceramic body based on diffusion and mechanical theory and this is not previous thin and thick layer on a ceramic body.
This invention will be good to make many kinds of new electrical ceramic components and devices having precise and high property with lower material cost and lower manufacturing cost due to it’s unique technology and dimension.
For example, the electrically functional layer provides only thermal sensing or ESD absorbing properties and a ceramic body provides only mechanical properties as SMD ceramic chips.

Also, Joinset’s new Thermistor series called “Jointherm” and new ESD absorber called “LopiVa” alre

 
Launching High Q MLCC to Market

Launching High Q MLCC to Market Joinset is starting…

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Launching High Q MLCC to Market

Joinset is starting to supply High Q MLCC to market.
The High Q MLCC are developed by Joinset and the main market are the devices of RF Telecommunication, Military, Plasma and etc.
Some special High Q MLCC has High Voltage properties.
So, Joinset have got both of High Voltage MLCC and High Q MLCC.

 
Got US patent for Multi-functional Metal Shield Ca

Got US patent for Multi-functional Metal Shield Case…

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Got US patent for Multi-functional Metal Shield Case and Method for making the same :

Joinset got US patent for Multi-functional Metal Shield Case and Method for making the same.
This patent include thermally conductive layer and/or electromagnetic absorber at inside of Metal Shield Case for thermal spread and/or EMI absorbing.
This technology could help mobile telecommunication devices and electrically heating devices to reduce heat and EMI noise.